We are currently experiencing a significant turning point in the semiconductor industry, marked by the rapid adoption of heterogeneous integration of dies into a single package. This new architecture presents unique challenges and demands. However, one thing is certain: the industry needs an interconnect that quickly and reliably links the dies. The Universal Chiplet Interconnect Express (UCIe) has emerged as the leading standard for die-to-die connectivity due to its flexibility, comprehensive stack support, and technical strengths. This podcast delves into the UCIe standard, describing the challenges it helps designers tackle, some of the progress since its inception, and ways to maximize UCIe beyond the standard’s definition. We will also explain how to best utilize UCIe to cater to your specific application needs.

In this podcast, we talk about MCUs, automotive memory and clock generators through interviews from embedded world 2024 with executives from STMicroelectronics, Micron Technology, SiTime, and Nuvoton.

In this embedded edge with Nitin podcast, we explore megatrends in memory and storage in automotive, virtualization and development tool support for automotive SoCs, and embedded vision, through interviews with Micron Technology, Green Hills Software, and e-con Systems.