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Recorded live at SEMICON West 2024, SEMI’s flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology.

This episode features Françoise von Trapp’s conversation with Jose Fernandez, Under Secretary of Economic Growth, Energy, and The Environment for the Department of State, to talk about securing critical supply chains for the 21st century.

Fernandez discussed the importance of addressing geopolitical issues and ensuring supply chain resilience, particularly in the aftermath of the pandemic. He highlighted the importance of establishing global semiconductor supply chains that meet clean energy goals to galvanize a clean energy future. He also emphasized the need to prioritize security over efficiency and highlighted the issue of semiconductors seeping into Russia despite sanctions.

You’ll also learn:

• How the U.S. Department of State International Technology Security and Innovation Fund (ITSI) supports workforce development and is helping to secure critical minerals.
• About the impact of sanctions on Russia's semiconductor industry, and how companies are working together to improve due diligence and prevent the flow of semiconductors into Russia

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Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies.

Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and Science Act, implementation updates, and government investments in semiconductor manufacturing and supply chain.

Key takeaways included the importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.

You’ll learn about:

• Strategic partnerships with industry to ensure Chips Act investments achieve long-term goals.
• Advanced packaging R&D funding opportunities.
• Global semiconductor industry collaboration and government support.

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

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Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.

You'll learn about:

• Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking
• 3D IC design tools and their evolution
• Digital twins, chiplet architectures, and 3D integration processes in semiconductor design
• Innovator 3D IC - a new product " for faster, more predictable chip design
• Siemens' new 3D IC design platform for concurrent design and optimization.
• How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.

Learn more about Innovator 3D IC

Contact AJ Incorvaia on LinkedIn

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Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

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In this episode, Françoise von Trapp speaks with Christine King, the world’s first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir about her journey, called Breaking Through the Silicon Ceiling, which details her journey and provides insights on work-life balance at IBM and beyond.

Christine talks about how she overcame adversity and stumbled into engineering and entrepreneurship. She shares stories of how she made her way up the IBM corporate ladder, overcoming challenges such as gender bias and roadblocks from male colleagues.

You’ll learn about her 12 lessons for success, the importance of mentorship, networking, and sponsorship, and the need for individuals to advocate for themselves and support each other in their careers.

Christine King’s book, Breaking Through the Silicon Ceiling, is available here on Amazon and Barnes and Noble.

Connect with Christine King on LinkedIn.

Correction: the interview states that the book was released on July 4, 2024. But its actual release date was June 28, 2024.

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Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent.

In this episode, Françoise von Trapp speaks with Andreas Lippert, of Saxony Trade and Invest, and Jan Klinger, of Fabmatics, about the region's unique ecosystem for microelectronics, government co-funding, and innovation.

You'll learn about:

• Saxony's history in innovation and competitiveness, and its impact on developing strong industrial sectors.
• Saxony's microelectronics cluster and its growth potential
• Germany's commitment to sustainability in the semiconductor industry, and how automating legacy fabs provides environmental benefits.
• How Saxony is attracting skilled workers and employees, particularly women, by offering affordable housing, childcare, and education.
• Saxony's strengths in microelectronics and automation make it a promising location for the semiconductor industry.

Contact Our Guests on LinkedIn

• Andreas Lippert, Saxony Trade and Invest
• Jan Klinger, Fabmatics

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

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Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024).

Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the format and increasing the exhibition space helped organizers achieve record attendance. They also describe the volunteering opportunities and the pathway to leadership it provides. They shared their own experiences and the impact ECTC has had on their careers.

From the event itself, you'll learn about the importance of packaging technology and collaboration between chip and packaging communities to meet the high bandwidth requirements of AI applications. You'll also learn about advancements in hybrid bonding, metrology, and the impact of geopolitics in electronics packaging.

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This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology advancements key takeaways from ECTC 2024.

Guests include

• Vikas Gupta and Mark Gerber of ASE Group
• Rao Bonda and Nathan Whitchurch of Amkor Technologies
• Eelco Bergman and Bart Deprospo of Saras Micro Devices
• Simon McElrea of LQDX
• Rama Pulligada and Alex Smith, of Brewer Science
• Bob Patti of NHanced Semiconductors
• John Lannon of Micross
• Bob Chylak of Kulicke & Soffa
• Tony Gueli and Venkata Mokkapati of AT&S
• Kuldip Johal, MKS-Atotech
• Joel Scutchfield, Koh Young America

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Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

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Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA.

Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You’ll learn about the limitations of current photonics technology in data centers and proposes a new generation of integrated photonics and silicon to overcome these limitations. You’ll also learn about the development of unique laser technologies for energy efficiency and the latest advancements in optical communication technologies, including full-wafer fabrication and wafer-scale probe technology.

Learn more about Xscape Photonics.

Chet Lenox talks about the growing importance of metrology and inspection in advanced packaging processes. He shares highlights of an ECTC special session, such as the importance of including process control in the Heterogeneous Integration Roadmap, and a technology track on metrology and inspection in future ECTC programs.

You’ll learn why In-line metrology is crucial for controlling processes, ensuring defect-free surfaces, and reducing variability. Quality and yield are key concerns, and more inspection and metrology are needed in the early stages of R&D to ensure success.

Contact Our Speakers on Linkedin:

· Keren Bergman, Ph.D, Professor at Columbia University

· Chet Lenox, Fellow, KLA

Support the Show.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.